Production of semiconductor wafer comprises simultaneously polishing the front and rear sides of wafer between rotating polishing plates using an alkaline polishing sol and then an alcohol, cleaning, drying and applying an epitaxial layer

摘要

Production of semiconductor wafer comprises simultaneously polishing the front and rear sides of wafer between rotating polishing plates using an alkaline polishing sol and then an alcohol, cleaning, drying and applying an epitaxial layer. Production of a semiconductor wafer comprises: simultaneously polishing the front and rear sides of the wafer between rotating polishing plates with the introduction of an alkaline polishing sol, where the wafer lies in a recess of the rotor plate, whose thickness is around 2-20 mu m less than the thickness of the finished polished wafer; simultaneously treating the front and rear sides of the wafer between rotating polishing plates with the introduction of a liquid containing 2-6 C alcohols; cleaning and drying the wafer; and depositing an epitaxial layer onto the front and rear sides using the above three steps.