发明名称 ZnO COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE USING SILICON SUBSTRATE AND MANUFACTURING METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device and its manufacturing method that use a ZnO-family compound semiconductor, are a vertical type that can take out an electrode from the upper and lower surfaces of a chip, having superior crystallinity of a semiconductor layer and high light emission efficiency, at the same time, which do not use a sapphire substrate, and are convenient in a manufacturing process and use. SOLUTION: A silicon nitride film 2 is provided on the surface of a silicon substrate 1, at least n-type and p-type layers 3 and 4 and 6 and 7 consisting of a ZnO-family compound semiconductor are provided on the silicon nitride film 2, and a semiconductor lamination part 11 is laminated, so that a light emission layer is formed. The silicon nitride film 2 is preferably subjected to heat treatment under atmosphere, where nitrogen as an ammonia gas exists for forming.</p>
申请公布号 JP2001044499(A) 申请公布日期 2001.02.16
申请号 JP19990211222 申请日期 1999.07.26
申请人 AGENCY OF IND SCIENCE & TECHNOL;ROHM CO LTD 发明人 NIKI SAKAE;IWATA HIROYA;PAUL FONSU;TANABE TETSUHIRO;TAKASU HIDESHI
分类号 H01L33/14;H01L33/16;H01L33/28;H01L33/32;H01L33/34;H01L33/42;H01L33/62;H01S5/00;H01S5/327 主分类号 H01L33/14
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