| 摘要 |
PROBLEM TO BE SOLVED: To reduce generation of induction noise in a power converter and to enhance cooling efficiency of a power semiconductor element. SOLUTION: Three heat sinks 10U, 10V, 10W having a large number of heat dissipation fins 12 on the surface side of a base member 11 are fixed individually, on the rear side of the base member, with the power semiconductor elements 6 for respective phases of a power converter and three heat sinks fixed with the power semiconductor elements 6 are arranged inΔ. Heat generated from the power semiconductor elements for U, V, W phases is transmitted through the base members 11 of the heat sinks 10U, 10V, 10W to the heat dissipation fins 12 directed outward and dissipated into the air thus ensuring efficient cooling.
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