METAL INTERCONNECT LAYOUT OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A metal interconnect layout is to form an extended contact overlapped portion on a side end of a contact overlapped portion. CONSTITUTION: A contact overlapped portion(20) is formed on a longitudinal end of a metal interconnection(10) to electrically connect to a lower metal interconnection. The contact overlapped portion is provided with at least one contact(30,40). The contact overlapped portion has to secure a minimum distance according to a minimum overlap rule extended from a contact overlapped portion boundary. To the end, a side end of the contact overlapped portion extended from the longitudinal end of the metal interconnection includes an extended contact overlapped portion(50) having a predetermined margin width on a side end portion of the extended contact overlapped portion. The extended contact overlapped portion is formed to compensate a portion to be cut at the contact layout portion. A distance between an outer boundary surface and the extended contact layered portion and a boundary surface of the second interconnection(100) by forming the extended contact layered portion.