| 摘要 |
<p>A method for manufacturing a semiconductor device in which outer connection faces of the leads that are electrically connected to a semiconductor chip are exposed flush with a surface of the package. The method comprises a resin encapsulating step of integrally forming an encapsulating part for encapsulating the semiconductor chip and a protective resin layer for almost covering the outer connection faces, and a resin removing step of removing at least a part of the protective resin layer to expose the outer connection faces. The resin removing step may be a grinding step of grinding the protective resin layer.</p> |
