| 摘要 |
<p>The system processes one or more wafers from a FOUP (12') to an ion processing chamber. A group of wafers from the FOUP (12') is removed by a first end effector (20'a) and loaded into a load lock (30) through a lower door in an atmosphere opened position. The load lock (30) is sealed, evacuated, and an upper door is opened to a vacuum opened position. A second end effector (32a) connected to a 3-axis robot moves one of the wafers from the load lock to the ion processing chamber. A wafer alignment robot (34) can also be used. Wafers are sequentially processed from the load lock (30) to the processing chamber until complete; and then the wafers within the load lock (30) are sealed, pressurized, and moved back to the FOUP (12'). A second load lock (30), and multiple FOUP (12'), are used to increase throughout.</p> |
