| 摘要 |
<p>An electroplating solution for fabricating a multilayer printed board in such a way that the top face of a via hole is generally flush with the top face of a conductor circuit in the same layer. The electroplating solution used for fabricating a multilayer printed board where a resin insulating layer and a conductor circuit are formed in multilayer on a board where the conductor circuit is provided, is characterized in that the electroplating solution contains 50-330 g/l of copper sulfide, 30-200 g/l of sulfuric acid, 25-90 mg/l of chloride ions, and 1-1000 mg/l of an additive at least consisting of a smoothing agent and a brightening agent.</p> |
