SOLDER TESTING METHOD AND APPARATUS

摘要

PURPOSE: A solder testing method and an apparatus are provided to test a component body and a solder of a mounting component having a lead which is fixed on a PCB. CONSTITUTION: A ring illuminating device has upper and lower illuminating lamps which have different incidence angles toward a solder with respect to a plate surface of a PCB. A camera controls the upper illuminating lamp to illuminate the solder and photographs an area having the solder in a direction perpendicular to the plate surface of a PCB to obtain an upper illuminating image. A camera controls the upper illuminating lamp to illuminate the solder and photographs an area having the solder in a direction perpendicular to the plate surface of a PCB to obtain a lower illuminating image. A vision processor sets a location of a lead testing window on a screen corresponding to a testing area of the solder based on an outline of a component body in the upper illuminating image and estimates a good part of the solder based on the lower illuminating image.