发明名称 STRUCTURE FOR GROUNDING IN HEAD DRUM DEVICE
摘要 PURPOSE: A structure for grounding in a head drum device is provided to improve productivity through easily assembling components and to improve service efficiency through easily disassembling the components. CONSTITUTION: A tip shaped ground member(56) fixed at an elastic member(54) of a fix member(52) is inserted to a through hole(53) of a boss(42A). A combining aperture of the fix member is combined to a fix shaft(2A) protruded from the boss. At identified state of combining/inserting apertures of boss/fix member, a fixing nut is inserted to combining aperture of the boss. At completed state of assembly, the ground member is elastically contacted to outer ring(55) of an upper bearing(6A) by the elastic member.
申请公布号 KR20010010684(A) 申请公布日期 2001.02.15
申请号 KR19990029708 申请日期 1999.07.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAEK, CHUNG HEUM;CHO, YEONG HO;CHOI, DO YEONG;CHOI, HYEONG SEOK;HONG, SEONG HUI;KIM, JUN YEONG;LEE, SEUNG HAN;LEE, SEUNG U
分类号 G11B15/61;G11B5/52;G11B5/53;(IPC1-7):G11B5/52 主分类号 G11B15/61
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