Cooling gas used with a self-sputtering method

摘要

A plasma sputtering reactor (10), particularly one designed for sustained self-sputtering of copper or for low-pressure sputtering, in which the pedestal (16) supporting the wafer (18) to be sputter deposited includes backside cooling or heating of the wafer through a thermal transfer gas (60), the thermal transfer gas being helium. Argon (24) is supplied to strike the plasma (38) and may be additionally supplied during operation for low-pressure sputtering.