发明名称 |
Bond pad for a flip chip package, and method of forming the same |
摘要 |
A bond pad support structure is located beneath a bond pad on an integrated circuit. The bond pad support structure includes a first bond pad support layer at least partly located below the bond pad. The first bond pad support layer has a plurality of radial patterns with at least one space between the radial patterns. The radial patterns may be, for example, straight lines having approximately uniform thickness. Alternatively, the radial patterns may be triangles, each of which has an apex pointing to the center of a region below the bond pad. The radial patterns may have a plurality of different lengths. A second bond pad support layer is located on the first bond pad support layer. The second bond pad support layer fills at least a portion of the space between the radial patterns.
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申请公布号 |
US6187658(B1) |
申请公布日期 |
2001.02.13 |
申请号 |
US20000503814 |
申请日期 |
2000.02.15 |
申请人 |
LUCENT TECHNOLOGIES, INC. |
发明人 |
CHITTIPEDDI SAILESH;RYAN VIVIAN |
分类号 |
H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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