| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a separable chip compared with a conventional size while sufficiently taking a cushioning measures. SOLUTION: This device comprises a pair of large and small holding rollers 4a, 4b parallel to each other to apply the stress enough to split along splitting grooves a substrate 3 with a large number of chip parts 2 connected thereto via the splitting grooves 1, a circulating carriage belt 5 to transfer the substrate 3 between the large and small holding rollers 4a, 4b, and a film feeding means 7 to feed a protective film 6 to cover a surface of a chip parts 2 between the large and small holding rollers 4a, 4b from a proximal side of the large and small holding rollers 4a, 4b along the carriage belt 5.
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