| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition suffering little warpage in a soldering treatment and exhibiting an excellently low elastic modulus by incorporating as essential ingredients an epoxy resin, a phenol resin curing agent, an inorganic filler and a curing accelerator and specifying a composition and a softening point of the epoxy resin and respective amounts of the phenol resin curing agent and the inorganic filler compounded. SOLUTION: The subject epoxy resin composition comprises an epoxy resin (A) obtained by mixing a polyhydric phenol resin represented by formulae I and II (wherein, R is a 1-5C hydrocarbon or the liket (m) is 0-4, (n) is 0-35 and (k) is 1-10) with a phenol, which is a precursor of a crystalline epoxy resin, followed by glycidyl-etherification, a phenol resin curing agent (B) represented by formula III, an inorganic filer (C) and a curing accelerator (D). The weight ratio of the polyhydric phenol resin to the precursor phenol in the component A is 1-19. The softening point of the component A is 70-120 deg.C. The equivalent ratio of phenolic hydroxyl groups in the component B to epoxy groups in the component A is 0.5-2.0. The component C is contained in an amount of 250-1,400 pts.wt. based on 100 pts.wt. of the total of the components A and B.
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