发明名称 RADIATION CURING PASTE COMPOSITION FOR BAKING AND STRUCTURE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a radiation-curing paste composition for baking capable of increasing the aspect ratio of a pattern to be formed and shortening the pattern-forming process and provide a structure using the same in a method for forming inorganic structures such as insulators, dielectrics and the likes by printing or transcription. SOLUTION: This radiation-curing paste composition comprises (A) an inorganic powder containing a black pigment which reduces permeability in the ultraviolet region by baking at >=400 deg.C, (B) a photopolymerization initiator and (C) a radiation-curing monomer containing an acryloyl group of >=2 functionality and has a saturated chain hydrocarbon structure having >=4C atoms as a main ingredient. Instead of the ingredient (C), (D) a radiation-curing monomer containing an acryloyl group of >=1 functionality and has >=4C saturated chain hydrocarbon structure and (E) a radiation-curing monomer containing an acryloyl group having >=2 functionality can be used.
申请公布号 JP2001040021(A) 申请公布日期 2001.02.13
申请号 JP19990217067 申请日期 1999.07.30
申请人 TOPPAN PRINTING CO LTD 发明人 KATO ISAO;ARAI JUNICHI
分类号 H01G4/12;C08F2/46;H05K1/03;(IPC1-7):C08F2/46 主分类号 H01G4/12
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