High density patching system

摘要

The present disclosure relates to high density patching system. The system includes a card housing having a front end positioned opposite from a rear end. The card housing includes top and bottom walls extending between the front and rear ends. The top and bottom walls define opposing sets of top and bottom slots. The patching system also includes a plurality of patch cords including patch plugs each having a width WI and a height HI. The patching system further includes a plurality of jack access cards adapted to be mounted in the card housing, and a rear interface module positioned at the rear end of the card housing. The jack access cards include circuit boards having top and bottom edges adapted to fit within the sets of top and bottom slots defined by the card housing. The jack access cards also include a plurality of card edge contacts positioned at a rear of each circuit board. The jack access cards further include front interface pieces having heights H2 that are greater than two times the height H1, and widths W2 that are each less than two times the width W1. The front interface pieces each define upper and lower patch plug ports that are vertically spaced along the height H2 of each front interface piece. The upper and lower patch plug ports are sized and shaped to receive only a single one of the patch plugs at a time. The rear interface module includes a single row of card edge connectors adapted for providing electrical connections with the card edge contacts of the jack access cards. The rear interface module also includes an array of rear connectors including upper and lower rows of rear connectors. The array of rear connectors is electrically connected to the card edge connectors by a flexible circuit board. The rear interface module also includes a frame that spaces the card edge connectors from the rear connectors. The frame includes a rear wall defining upper and lower rows of openings that respectively receive the upper and lower rows of rear connectors.