| 摘要 |
A new apparatus and process for soldering surface-mount and through-hole type electronic components into a printed circuit board (PCB) in an automated fashion utilizing localized electromagnetic induction heating. Current manufacture technology for packaging electronic components depends exclusively on the reflow and wave soldering processes. Both processes heat up to relatively high temperature the entire assembly, namely its PCB and all the electronic components been soldered into it. Such high temperature environment frequently causes components damage resulting in rejects and/or demanding rework. With this invention however, during a soldering operation only the leads and pads, or joints, being soldered are heated but neither the body, or casing, of said electronic components nor the dielectric material forming said PCB are heated. Because of this selectively localized heating, the invention permits to reduce cost and improve the quality and reliability of manufactured products. This invention consumes about 200 times less energy than the reflow and wave soldering processes. Also allows in-process, and in-situ, testing of soldered joints quality thus permitting rework before final assembly of a PCB is completed. This invention also provides for an useful de-soldering apparatus.
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