| 摘要 |
PROBLEM TO BE SOLVED: To reduce over and under polishing in a base board peripheral part. SOLUTION: A carrier head 100 for chemical mechanical polishing has a base 104 and a flexible film 118, and the lower surface of the film 118 provides the base board receiving surface to a base board 10, and has a first surface for applying first pressure to the first portion of the base board. A second surface for surrounding the first surface applies second pressure to the second portion of the base board, and an edge load ring 120 surrounds the second surface. The lower surface of the ring 120 is equipped with a third surface for applying third pressure to the third portion of the base board for surrounding the second portion. |
