| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor which is excellent in balance among high flowability, solder-resistant reflow property and low wear property of dies, and to provide silica powder suitable for the resin composition. SOLUTION: In this silica powder, the content of <=1μm particle size is 3 to 30 wt.%, >=80% (including 100%) of the particles having <=1μm particle size, are spherical particles having <0.90 roundness, and 30 to 80% of particles having 5 to 10μm particle size are aspherical particles having <0.90 roundness. This resin composition contains the silica powder.
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