| 摘要 |
A packaged microelectromechanical device having a housing with a plurality of ports. A bundle of a plurality of optical fibers is mounted in one of the plurality of ports by a welded or brazed flange. An array-type microelectromechanical device is mounted in another port of the housing by a welded or brazed flange and includes a plurality of elements adapted for interacting with the plurality of optical fibers, whereby information may be transmitted into the housing via one of the optical fibers and may be transferred out of the housing via another of the optical fibers. The array-type microelectromechanical device has a plurality of electrical control pins protruding outside the housing. A pair of windows in the housing provides ports for optical sensory signals for the array-type microelectromechanical device. Two conduits for providing pressurized inert gas are mounted in the housing by welded or brazed flanges. The housing provides a hermetically sealed enclosure for the bundle of the plurality of optical fibers, the windows, the array-type microelectromechanical device, and the conduits. The pressurized inert gas is used to remove dust and moisture during assembly but remains in the finished assembly. Helium in the gas enables detection of leaks.
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