发明名称 |
Plastic encapsulated IC package and method of designing same |
摘要 |
A method for designing an IC package having a plastic encapsulated portion and a lead frame portion that are bonded together at a bonding interface includes selecting material candidates for each of the plastic encapsulated portion and the lead frame portion to obtain possible material combinations. A peeling stress and a shear stress at the bonding interface for each possible material combination is determined. A design material combination from all of the possible material combinations is then selected based on a singularity parameter and stress intensity factors of the peeling stress and the shear stress. To enhance the IC package, a circular fillet feature having a radius is added to a singularity point at the bonding interface of the IC package to reduce the stress at the singularity point. The value of the radius is determined from a predefined range of radii based on the singularity parameter and stress intensity factors of the peeling stress and the shear stress at the singularity point for each of the radii.
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申请公布号 |
US6187601(B1) |
申请公布日期 |
2001.02.13 |
申请号 |
US19980021732 |
申请日期 |
1998.02.11 |
申请人 |
FORD GLOBAL TECHNOLOGIES, INC. |
发明人 |
HU JUN MIN;PAO YI-HSI |
分类号 |
H01L23/495;(IPC1-7):G01R31/26;H01L21/66;H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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