| 摘要 |
A film support and circuit board assemblage for a camera includes a film support which has a group of film supporting projections that each project an identical height from a film facing side of the film support, and a circuit board which has a raised part. The film support has a film supporting projection that projects from the film facing side the same height as the group of film supporting projections and that is hollow to form an open cavity in an opposite side of the film support. The circuit board is arranged next to the opposite side of the film support, with the raised part protruding into the cavity to make the camera compact.
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