发明名称 VENTILATION STRUCTURE FOR BUILDING
摘要 PROBLEM TO BE SOLVED: To keep the thermal environment of an attic space in a satisfactory state by forming a first ventilation path communicating upward from the underfloor portion of a building through an outer wall member with the upper and lower parts and a second ventilation path communicating with the outdoor through a roof member without passing through the attic space. SOLUTION: A first ventilation path P1 communicating upward from the underfloor portion 1 of a building B1 through an outer wall panel 2 and a second ventilation path P2 communicating with outdoor through a roof panel 7 without passing through an attic space 9 are formed in this ventilation structure. The air inside the panels 2, 7 is heated by solar radiation and room temperature to the temperature somewhat higher than that of the air of the underfloor portion 1, it is moved upward and discharged outdoors, then air is sucked from the underfloor portion 1 and ventilated through the ventilation paths P1, P2. Since the ventilation paths P1, P2 do not pass through the attic space 9, the thermal environment of the attic space 9 can be kept in a satisfactory state by using a high-performance heat insulating material for the panel 7, for example.
申请公布号 JP2001040785(A) 申请公布日期 2001.02.13
申请号 JP19990215552 申请日期 1999.07.29
申请人 S X L CORP 发明人 TAMAMIZU SHINGO;KOMAGAWA TOSHIHIRO
分类号 E04B1/70;(IPC1-7):E04B1/70 主分类号 E04B1/70
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