POLISHING DEVICE OF FOUR-WAY SPINDLE SHAFT

摘要

PROBLEM TO BE SOLVED: To perform super accurate flat work and mirror finish work of an extremely thinned and diametrically expanded semiconductor wafer by polishing the semiconductor wafer by respectively sticking the semiconductor wafer to work heads under respective spindles. SOLUTION: Eight spindles 9 are carried a pair by a pair on the four sides of a rotatable indexing table 8 erected in almost the center of a base stand 1. A semiconductor wafer is stuck to work heads 10 arranged under the respective spindles 9. Three sets of polishing tables 11 are provided in the three directions except for an attachable position with the indexing table 8 as the center. The semiconductor wafer is attached in the attachable position to successively perform rough polishing work, medium polishing work and finishing polishing work by the three-way polishing tables 11. Thus, the extremely thinned and diametrically expanded semiconductor wafer can be efficiently polished with super accuracy.