| 摘要 |
A rear light entry photodetector chip is secured face-down with solder on to the front face of a ceramic submount provided with a pair of electrically conductive vias. A frame-shaped mass of solder seals the chip to the submount to provide a hermetic enclosure protecting sensitive semiconductor surface areas of the photodetector chip where electric fields are liable to be present in the vicinity of a pn or metal/semiconductor junction.
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