发明名称 |
Ohmic electrode structure, semiconductor device including such ohmic electrode structure, and method for producing such semiconductor device |
摘要 |
An ohmic electrode structure includes an n-InxGa1-xAs layer where 0<x<=1; a Pt or Pd layer provided on the n-InxGa1-xAs layer; and at least one metal layer provided on the Pt or Pd layer. A semiconductor device includes a substrate; a first semiconductor layer having a p-type conductivity provided on the substrate; a second semiconductor layer having an n-type conductivity provided on the substrate; an ohmic contact layer provided on the first semiconductor layer; a barrier layer provided on the second semiconductor layer; a first electrode provided on the ohmic contact layer; and a second electrode provided on the barrier layer. The ohmic contact layer and the barrier layer are each formed of a material selected from the group consisting of Pt and Pd.
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申请公布号 |
US6188137(B1) |
申请公布日期 |
2001.02.13 |
申请号 |
US19960652303 |
申请日期 |
1996.05.23 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
YAGURA MOTOJI;SATO HIROYA |
分类号 |
H01L21/28;H01L21/331;H01L29/43;H01L29/45;H01L29/73;H01L29/737;H01L29/80;(IPC1-7):H01L23/48;H01L23/52;H01L29/40;H01L31/025 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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