发明名称 |
Method and materials for through-mask electroplating and selective base removal |
摘要 |
Multilayer metal materials are selected so that the materials will alloy or intermix under rapid thermal annealing conditions. The individual materials of the multilayers are preferably chosen such that at least one of the materials may be selectively etched with respect to the other material by wet chemical or electrochemical etching. For electroplating applications, the alloyed plating base material will assume some of the etch resistance of the original electrodeposit material such that a selective wet etch of the plating base can be performed without substantial undercutting. Furthermore, the graded composition alloy will exhibit other advantageous physical and chemical properties for electrode formation and use. The alloying or intermixing may be accomplished before or after patterning of the materials, for the instance wherein the materials deposited as blanket layers. Similarly, the alloying or intermixing may be accomplished before or after plating base removal for structures deposited by through-mask plating.
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申请公布号 |
US6188120(B1) |
申请公布日期 |
2001.02.13 |
申请号 |
US19970805403 |
申请日期 |
1997.02.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDRICACOS PANAYOTIS CONSTANTINOU;CABRAL, JR. CYRIL;CARRUTHERS ROY;GRILL ALFRED;SAENGER KATHERINE LYNN |
分类号 |
H01L21/288;H01L21/02;H01L21/8242;H01L21/8246;H01L21/8247;H01L27/10;H01L27/105;H01L27/108;H01L29/788;H01L29/792;(IPC1-7):H01L27/108 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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