发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the degradation of the cutting performance by preventing adhesion of chips of a work to a blade and a circumferential surface of an anvil roll, and to improve the service life of the blade by preventing the distance between the blade and the circumferential surface of the anvil roll from being reduced due to the thermal expansion of a cutting roll. SOLUTION: This cutting device is provided with a cutting roll 1 with a blade 11 provided on a circumferential surface 12a and an anvil roll 2 with circumferential surfaces 12a, 22a opposite to each other, and a long size workpiece 51 is passed between both circumferential surfaces 12a, 22a to cut the workpiece 51. The refrigerant is distributed within at least the cutting roll 1 (a hollow part 12c and a piping 14a).
申请公布号 JP2001038675(A) 申请公布日期 2001.02.13
申请号 JP19990221744 申请日期 1999.08.04
申请人 KAO CORP 发明人 MATSUDA TADASHI
分类号 B26D7/08;B26D1/40;B26F1/38;B26F1/44;(IPC1-7):B26D1/40 主分类号 B26D7/08
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