Cast column grid array extraction apparatus and method

摘要

An apparatus for removing a casting comprising an electronic package substrate and an array of cast solder columns having a column pitch of less than 2 mm extending therefrom from the corresponding openings of a mold. The apparatus includes a removable mold containing a plurality of openings for casting a corresponding array of solder columns and bonding the columns to the underside of an electronic package substrate. A stripper plate for receiving the mold contains openings through a thickness thereof corresponding to at least some of the openings in the mold. An ejector assembly including ejector pins having a length at least as long as the sum of the thickness of the stripper plate at the stripper plate openings and the thickness of the mold at the column casting openings, and corresponding to openings in the mold and the stripper plate. The mold and the ejector assembly are relatively movable toward each other to cause at least some of the ejector pins to engage cast columns in the mold openings and push the engaged cast columns and substrate out of the mold. The stripper plate is movable relative to the ejector pins away from the ejector assembly after the ejector pins push the cast columns and substrate out of the mold.