发明名称 Method of resin molding
摘要 The method of resin molding is capable of preventing molded products from forming resin flash on their surfaces. The method comprises the steps of: covering over a parting face, of at least one of molding dies with release film; clamping a work piece, with the release film, by the molding dies; and filling the melted resin in the molding section of the molding die, wherein the release film is tightly pressed on a surface of a part of the work piece, which is exposed after molding, in the clamping step. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.
申请公布号 US6187243(B1) 申请公布日期 2001.02.13
申请号 US19980112018 申请日期 1998.07.08
申请人 APIC YAMADA CORPORATION 发明人 MIYAJIMA FUMIO
分类号 B29C33/68;B29C45/00;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/14 主分类号 B29C33/68
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