发明名称 |
Apparatus and method for transporting wafers |
摘要 |
An apparatus and a method for transporting wafers into a process chamber are disclosed. The wafer-transporting blade for transporting wafers consists of a generally elongated blade member that has a top surface for engaging and holding a wafer positioned thereon, wherein at least a portion of the top surface is provided with a surface roughness sufficiently great to frictionally engaging a wafer positioned thereon without slippage. The surface roughness may be provided by either a mechanical or a chemical method.
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申请公布号 |
US6187103(B1) |
申请公布日期 |
2001.02.13 |
申请号 |
US19980141066 |
申请日期 |
1998.08.27 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG C. Y.;DING T. H. |
分类号 |
H01L21/687;(IPC1-7):C23C16/00 |
主分类号 |
H01L21/687 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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