OPTICAL MAGNETIC HEAD OF MAGNETO-OPTICAL RECORDING/ REPRODUCING DEVICE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To facilitate adhesion and maintaining of adhesion and to reduce assembling man-hour by sticking thin film-like micro coils on one surface of a lens through a solder bump. SOLUTION: A solder bump 161 is arrayed so that two coil layers are independently connected to each of conductive reflecting films divided into two. That is, in order to secure the prescribed contacting area between the solder bump 161 and a conductive reflecting film 129 and execute electrode separation from the conductive reflecting film 129, arrangement is executed by plating after forming a pattern in the upper part of a second coil layer. Since welding is disturbed by the naturally oxidized film existing in the solder bump 161, thermal welding of a lens 120 to the solder bump 161 is thermally executed without using flux by a fluxless reflow soldering system under a high purity nitrogen atmosphere or vacuum atmosphere. Thus, the formation of the oxidized film on the surface of the solder bump 161 owing to a high temperature is prevented and whereby adhesive strength is improved.