WAFER TRANSFER DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE COMPRISING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent dirt and dust from sticking to a wafer, related to a wafer transfer device wherein a wafer transfer robot makes reciprocal linear movement by a linear motor. SOLUTION: A fixed base 9 to which a secondary side of a linear motor N for reciprocal linear movement of a wafer transfer robot R is fitted is attached along the lengthwise direction of a device body 1 of a wafer transfer device A in the longitudinal direction. The dust and dirt falling on the air current of a clean air K from a cleans air supplying device 4 is sucked for exhaustion into an exhaust fan 5 provided at a bottom-surface 1c of the device body 1, without depositing on the fixed base 9 and the upper surface of the secondary side.