| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device and bonding tool for electronic part which perform stable bonding at a low cost and stable vibration. SOLUTION: A bonding tool compression-bonds an electronic part to a bonding surface under a load and vibration. Here, a through hole 15c is provided, orthogonally to a length wise direction, at an electronic part pressurizing position corresponding to the loop of a standing wave vibration at the center of a horn 15, and a chucking part 30 which chucks and holds an electronic part 40 while pressurizing it to a substrate for compression-bonding is detachably fastened to the horn 15 with a bolt 33 penetrating the through hole 15c. Thus, no mechanism or part for fastening is required at the attaching surface of the chucking part 30, assuring a design flexibility for the chucking part 30 is assured as appropriate for a symmetrical electronic part, and stable tight- fitting state and vibration characteristics are kept. |
