| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device and a semiconductor device capable of preventing an increase in packaging area, and a semiconductor substrate and an electronic device. SOLUTION: A trench 16 is formed, by etching, on the surface of a substrate 12 for connection. After the trench 16 is formed, a metal wiring 18 is formed on the surface such that it crosses the trench 16 and a terminal 20 is formed on the surface of the wiring 18 and then a semiconductor chip 14 having on the side a pad 22 for connection electrically connected to the terminal 20 is mounted on the trench 16. I f the semiconductor device 10 is constituted in this manner, the semiconductor chip 14 is erected on the surface of the substrate 12 for connection and hence the packaging area of the semiconductor chip 14 is as large as the area of the side of the semiconductor chip 14. Therefore, more semiconductor chips can be mounted in the same area on the substrate.
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