| 摘要 |
PROBLEM TO BE SOLVED: To fix a substrate, without having to use solders having different fusion points nor causing an electronic cooling element to shift in position. SOLUTION: According to the assembling method for optical device, a flat electronic cooling element is soldered and fixed at a prescribed position by being heated from the reverse side of a bottom plate, while having its reverse surface jointed on the bottom plate 22 of a housing, a 1st substrate 35 for supporting a laser diode component 40 is mounted on the top surface of this electronic cooling element 30, and the pat of the 1st substrate 35, which is exposed in a cut 36 and does not overlap with the 1st substrate 35, is heated from the reverse side of the housing and the 1st substrate 35 is pressed, while being waggled in parallel with the bottom plate 22 to solder the reverse surface of the 1st substrate 35 and the top surface of the electronic cooling element 30 together.
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