| 摘要 |
PROBLEM TO BE SOLVED: To evenly spread an underfill agent around a through-hole and to assure the stable floating of a head slider by providing a head IC mounting surface with the through-hole and injecting the underfill agent via the through- hole from the surface on the side opposite to the head IC mounting surface between the head IC and the head mounting surface, thereby adhering the head IC in the opening of the through-hole. SOLUTION: After the head IC 2 is packaged onto a head suspension 1, the underfill agent 4 is injected via the through-hole 6 between the head IC 2 and the head suspension 1 from the rear surface of the head suspension 1. The underfill agent 4 consists of a UV curing resin or thermosetting resin and is injected for the purpose of the protection of the head IC 2 and the adhesion of the head IC 2 to the head suspension 1. The underfill agent 4 injected from the through-hole 6 spreads radially around the through-hole 6. As a result, the twisting of the head suspension 1 by the load of the underfill agent 4 is averted.
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