发明名称 SILVER SUPERFINE PARTICLE INDEPENDENTLY DISPERSED SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide a silver-containing superfine particle dispersed solution having low electric resistance at an LSI operating temperature capable of forming a conductive uniform fine pattern by mixing an organic solvent which hardly evaporates at room temperature but evaporates in silver wiring with silver-containing superfine particles having a specified particle size or less, covering the surfaces of the superfine particles with the organic solvent to independently disperse the superfine particles. SOLUTION: A silver-containing fine particle has a particle size of 0.01μm or smaller and a viscosity at room temperature of 50 cp or lower. As the organic solvent, which preferably evaporates at 150 deg.C or higher, mineral split, tridecane, dodecylbenzne, mixtures thereof, or their mixtures withα-terpineol is preferably used. Furthermore, hydrocarbon having 5 or more carbon atoms, alcohol, ether, ester, ketone, organic nitride, organic silicon compound, organic sulfur compound or a mixture thereof can be properly mixed. The silver- containing ultrafine particle is desirably formed of silver, silver oxide or a mixture thereof, and the concentration is desirably set to 15-50 wt.%.
申请公布号 JP2001035255(A) 申请公布日期 2001.02.09
申请号 JP19990207577 申请日期 1999.07.22
申请人 VACUUM METALLURGICAL CO LTD;ULVAC JAPAN LTD 发明人 AARIPPU KUTOURUKU;ODA MASAAKI;YAMAKAWA HIROYUKI;MURAKAMI HIROHIKO
分类号 H01L21/3205;H01B1/00;H01B1/22;H01L21/28;H01L21/283;H01L21/288;H01L23/52;(IPC1-7):H01B1/22;H01L21/320 主分类号 H01L21/3205
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