发明名称 COMPOSITION OF PHOTOSENSITIVE POLYIMIDE PRECURSOR
摘要 PURPOSE: Provided is a polyimide precursor which uses the diamine such as 1,3-bis(4-diaminophenoxy)-2,2-dimethylpropane, as a synthesis monomer and represented by formula 1. The composition has the good light permeability and accordingly excellent resolution as well as good photosensitivity and good capability of forming images. The semiconductor device is made by this precursor composition as a pattern membrane. The thick polyimide pattern is possible so that it makes no cracks in the final device. It also has more improved film properties such as tensile strength and elongation than the existing compositions, together with heat resistance, mechanical property and binding strength with the substrate. The polyimide pattern membrane manufactured by the above precursor does not produce chlorine and urea as by-products. CONSTITUTION: The composition comprises: the polyimide precursor of 2,000-200,000 average molecular weight, represented by formula 1; 1-100wt.%(based on the polyimide precursor) of photosensitive compounds which has either carbon-carbon unsaturated group without amino group or both amino group and C-C unsaturated group, or their mixture; a photo-polymerization initiator; and selectively a sensitizer, a thermal polymerization inhibitor and inorganic fine particle. In the above polyimide precursor represented by formula 1, R1 is an organic group of valence 4 with C2-C22, R2 is either an organic group with C1-C15 having no unsaturated bond or a photosensitive organic group of valence 1 with C3-C15 having C-C unsaturated group, R3 is an organic group of valence 2 with C1-C22, n is 0-99, X is represented by the formula(I), and Z is represented by the formula(II) or(III).
申请公布号 KR100288846(B1) 申请公布日期 2001.02.12
申请号 KR19980003854 申请日期 1998.02.10
申请人 CHEIL INDUSTRIES INC. 发明人 CHOI, JIN SEONG;JUNG, MYEONG SEOP;KIM, DO YUN;MUN, BONG SEOK;NOH, CHANG HO;PARK, JAE GEUN
分类号 G03C1/72;(IPC1-7):G03C1/72 主分类号 G03C1/72
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