发明名称 |
METALLIC BASE CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a metallic base circuit board which has a superior heat radiating property and high electrical reliability. SOLUTION: A metallic base circuit board is constituted by laminating conductive foil 3 upon a metallic plate 1 through an insulating layer 2 and forming a circuit by etching the foil 3. The insulating layer has a multilayered structure and a total thickness of 50-90μm. In addition, the thickness of the surface layer of the insulating layer 2 which is in contact with the foil 3 is larger than the lengths of the legs of the foil 3 which are in contact with the insulating layer 2.
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申请公布号 |
JP2001036204(A) |
申请公布日期 |
2001.02.09 |
申请号 |
JP19990207536 |
申请日期 |
1999.07.22 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
YASHIMA KATSUNORI;OGINO YUTAKA |
分类号 |
H05K1/05;(IPC1-7):H05K1/05 |
主分类号 |
H05K1/05 |
代理机构 |
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主权项 |
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地址 |
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