发明名称 METALLIC BASE CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a metallic base circuit board which has a superior heat radiating property and high electrical reliability. SOLUTION: A metallic base circuit board is constituted by laminating conductive foil 3 upon a metallic plate 1 through an insulating layer 2 and forming a circuit by etching the foil 3. The insulating layer has a multilayered structure and a total thickness of 50-90μm. In addition, the thickness of the surface layer of the insulating layer 2 which is in contact with the foil 3 is larger than the lengths of the legs of the foil 3 which are in contact with the insulating layer 2.
申请公布号 JP2001036204(A) 申请公布日期 2001.02.09
申请号 JP19990207536 申请日期 1999.07.22
申请人 DENKI KAGAKU KOGYO KK 发明人 YASHIMA KATSUNORI;OGINO YUTAKA
分类号 H05K1/05;(IPC1-7):H05K1/05 主分类号 H05K1/05
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