| 摘要 |
PROBLEM TO BE SOLVED: To obtain an organic package for reducing a switching noise or the like, and for loading a chip capacitor for removing a noise without projecting it. SOLUTION: A pad part 9 to be connected with a head part 8a of an outer connection pin 8 is formed on a resin substrate face 7, and the head part 8a is connected with the pad part 9 in this organic package. In this case, a resin layer 17 for adhesion which covers the root part of the outer connection pin 8 including the head part 8a is formed for increasing the strength of connection between the outer connection pin 8 and the resin substrate 1, and a hole part 18 for housing a chip capacitor 15 and a pad part 19 for loading the chip capacitor are formed at the resin layer 17 for adhesion. |
