发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To form a pattern of a good shape by using a positive type photoresist composition containing an alkali-soluble resin and a specified photosensitive component. SOLUTION: The positive type photoresist composition contains an alkali- soluble resin and a photosensitive component containing the esterified product of a compound of the formula and a 1,2-naphthoquinonediazidosulfonyl compound. The alkali-soluble resin is not particularly limited and may be arbitrarily selected from resins each generally usable as a film forming material in a positive type photoresist composition. A condensation reaction product of an aromatic hydroxy compound and aldehydes or ketones, polyhydroxystyrene or its derivative is preferably used as the alkali-soluble resin. The aromatic hydroxy compound is, such as phenol, m-cresol, p-cresol or o-cresol, 2,3-xylenol, 2,5-xylenol.
申请公布号 JP2001033957(A) 申请公布日期 2001.02.09
申请号 JP19990204404 申请日期 1999.07.19
申请人 TOKYO OHKA KOGYO CO LTD 发明人 HIDESAKA SHINICHI;SAWANO ATSUSHI;DOI KOSUKE;OBARA HIDEKATSU;NAKAYAMA TOSHIMASA
分类号 H01L21/027;G03F7/004;G03F7/022;G03F7/023 主分类号 H01L21/027
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