| 摘要 |
PROBLEM TO BE SOLVED: To confine an increase in the manufacturing period of a semiconductor device to the minimum, to perform easily a high-reliability trimming of wirings, to obtain the device having desired characteristics, and to obtain the manufacturing method of the device. SOLUTION: An opening 4 is provided in the same covering film as a normal pad without using a fuse, a plurality of conductors (wirings) 1 and 2 which are not made to have continuity electrically with each other are put arranged in the covering opening 4. After an electric test in a state of a wafer for the conductors 1 and 2 is executed, a wire 5 is bonded to the plurality of the above conductors (wirings) 1 and 2 in a bonding process in an assembly process, and the plurality of the conductors which are not made to have continuity electrically with each other are made to have continuity with each other. As a result, a trimming of the wirings can be performed without using the fuse and without adding a new process. |
