发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND POSITIVE TYPE PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To attain development with an aqueous alkali solution by using a specifieda polyimide precursor and a specified vinyloxy-containing compound. SOLUTION: The photosensitive resin composition comprises a polyimide precursor of formula I, a vinyloxy-containing compound of formula II, a sensitizer which is degraded under active light such as UV to generate an acid and a solvent. In the formula I, R1 is a tetravalent aromatic group, a tetravalent organic group formed by the single bonding of plural aromatic rings or the like, R2 is a divalent aromatic group, a divalent organic group formed by the single bonding of plural aromatic rings or the like and (n) is an integer of >=1. In the formula II, R3 is a di- or trivalent aliphatic group, an aromatic group or the like and (n) and (m) are each an integer of 1-3. The solvent for the polycondensation reaction of an acid component having an R1 skeleton and a diamine component having an R2 skeleton in the polyimide precursor may be N-methylpyrrolidone.
申请公布号 JP2001033958(A) 申请公布日期 2001.02.09
申请号 JP19990202430 申请日期 1999.07.16
申请人 TOSHIBA CHEM CORP 发明人 NOGUCHI YUICHI
分类号 G03F7/027;C08L79/08;G03F7/004;G03F7/039;H01L21/027 主分类号 G03F7/027
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