| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance reliability and downsize a package by lessening the number of parts of gate wiring and enhancing the accuracy in positioning, in a semiconductor device which is constituted by juxtaposing a plurality of semiconductor elements. SOLUTION: With respect to a semiconductor element constituted by fixing an IGBT chip 1 to a collector substrate 2, an insulating positioning guide 3 constitutes an individual semiconductor unit, with an emitter contact terminal 4 on the emitter electrode 21 of an IGBT chip 1 and a both-end contact structure of contact probe 5 on a gate pad 22. Each semiconductor unit is held en block by a gate liner 8, so that a silicon chip resistor 7 pressure-contacts with the other end of the contact probe 5. Hereby, the gate wiring becomes simple, and the individual positioning guide 3 prevents misalignment between the contact probe 5 and the gate pad 22.</p> |
