| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board, on which parts can be mounted at higher density using a simple process and which is highly reliable, a method for manufacturing the printed wiring board with a high yield, and a method for manufacturing a small-sized plastic molded item. SOLUTION: This manufacture of a printed wiring board comprises a step, in which 1st etching resist films 2a and 2b are formed selectively on one major surface of a conductive metal foil or thin plate 1, a step in which the metal foil or thin plate 1 where the films 2a and 2b are formed is half-etched to form a wiring pattern 1a in a projected shape on the major surface, a step in which the films 2a and 2b are removed and an insulator layer 3 is formed on the surface where the wiring pattern 1a is formed, a step in which the multiplayer structure is pressed into one body to embed the wiring pattern 1a in the insulator layer 3, and a step in which removal by etching is carried out except the embedded wiring pattern 1a.
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