| 摘要 |
PROBLEM TO BE SOLVED: To suppress occurrence of side cracks or interface cracks at the sidewall of ceramic or the bonding interface between the sidewall of the ceramic and a heat radiating substrate, when mounting a PKG where a semiconductor chip is laid directly on a heating board and the periphery is surrounded by the sidewall of the ceramic. SOLUTION: A PKG 10 has a recess 6 piercing in the thickness direction of a heating board 1, in each of a pair of opposed sides 8 and 9 in first direction of the heating board 1, and further it has a first groove 4 and a second groove 5 which are in parallel with the sides 8 and 9 in the first direction and moreover crossing the heating board 1, on the first surface side between a chip mount 2 and the recess 6 and the second surface side opposed to this first surface, respectively. What is more, the first groove 4 and the second groove 5 are made so as not to overlap each other. Moreover, the chip mount 2 is surrounded by a ceramic sidewall 3 including a first ceramic sidewall 31 which is substantially in parallel with the sides 8 and 9 in the first direction, and with the second ceramic sidewall 32 in the direction orthogonal to the first direction. |
