| 摘要 |
PROBLEM TO BE SOLVED: To easily provide various kinds of antenna circuit members without changing the whole manufacturing process even if the conductive pattern of an antenna conductive portion, the material of an antenna, the kind of IC chip, a packaging method, a material used for packaging are partially changed. SOLUTION: A conductive pattern 4 in which an IC chip packaging conductive portion 2 is connected to a conductive portion 3 for connection is mounted on a substrate 1. An IC chip 5 is packaged on the IC chip packaging conductive portion 2 to form an IC chip package A. A conductive pattern including an antenna conductive portion and a conductive portion 9 for connection is mounted on the substrate 1 to form an antenna holding member B. A conductive adhesive 6 is applied to at least one of the conductive portions for connection and then the respective conductive portions 3, 9 for connection are overlapped each other via the conductive adhesive 6 such that they are opposed to each other to bond the IC chip package A to the antenna holding member B.
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