| 摘要 |
<p>PROBLEM TO BE SOLVED: To materialize the manufacture of a semiconductor device where a package base and a semiconductor chip are united, and is capable of giving a marking mark for marking of type or manufacture history or marking of the directionality of an element, or the like. SOLUTION: A semiconductor substrate 10 is mounted on a package board 20, and a first wiring electrode 21 of the package board 20 and a bump 13 of the semiconductor substrate 10 are electrically connected with each other, thereby uniting the semiconductor substrate 10 with the package board 20. After this unification, an identification mark M for every light receiving element (semiconductor chip 1) is given to the other side 10b (the reverse of the face opposed to the package board 20) of the semiconductor substrate 10, and further the semiconductor substrate 10 and the package board 20 are cut integrally into a plurality of semiconductor chips 1 and package bases 2 and individual semiconductor devices A1 is formed.</p> |
