| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device having a high package density by improving a structure for directly connecting the leads of the semiconductor device. SOLUTION: A lead 3a fixed on at least one side of a package 4 is limited in a length to the outside end of the package 4. A butting portion 4a of the package 4 is formed by cutting away the end portion of the package 4 where the lead 3a having a limited length is fixed and the lead 3a is exposed at the butting portion 4a. The butting portions of the packages 4 are butted against each other and leads 3a are overlapped each other to connect semiconductors together.</p> |
