| 摘要 |
PROBLEM TO BE SOLVED: To prevent contact characteristic from deteriorating by the migration of solder from an IC lead to a contact pin coming into electrical contact with the IC lead in relation to a socket for testing an IC or the like. SOLUTION: A contact pin 10 is formed with a surface 13 abutting on a lead formed into a curved surface, nickel or titanium is sputtered on the surface of a contact pin base material such as gold-plated beryllium copper, and then the thin film is covered by spattering tungsten, chromium or titanium. Alternatively, nickel or titanium is spattered on the surface of a contact pin base material of beryllium copper not plated with gold, and then the thin film is covered by sputtering tungsten, chromium or titanium.
|
